Semiconductor Assembly Equipment

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Detailed Semiconductor Assembly Equipment Description:


Semiconductor Assembly Equipment
Specification:
Used UNIVERSAL INSTRUMENTS 4713 ADM Dispense Module. Designed to apply dots of adhesive on printed circuit boards (PCB) to prepare them for placement of surface mounted components. Positioning and board handling system can accommodate the same size PCB as the PASS-THRU II system: a maximum of 18 in. x 16 in. (457.2 mm x 406.4mm). The maximum PCB placement area of the model 4713D is 18 x 15.84 in. in the X and Y axes. Inventory: 29716

Semiconductor Assembly Equipment
  • Packing: Export Standard
  • Terms of Payment: T/T,T/C
  • Delivery Time: 30 Days
  • Products ID: 75857
  • Product Category: Auto Production Line Equipment
  • Post date: Apr 12, 2011
Our company is specialized exporter, manufacturer and supplier of Semiconductor Assembly Equipment in China.


           

Manufacturer/supplier's information

Company: Zhangjiagang Yuanteng Machinery Mould Co., Ltd.
Address: Zhangjiagang Economic Development Zone Yue Feng Road, No. 1,
Region: zhangjiagang, Jiangsu, China
Contact Person: Mr. honghai song
Telephone: 86-0512-58180286

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