COG Bonding M/C

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Detailed COG Bonding M/C Description:


Application:
The machine is used for aligning and bonding IC driver to various LCD glasses.

Key Feature:
■ Japanese controlling system and precise servo system.
■Precise THK linear modules auto-adsorb IC and alignment.
■High clearance CCD alignment vision system, cross mark alignment.
■Precise micrometer adjustable X-Y-θaxis of fixture.
■Panasonic human-machine interface, can store 50 set parameters.

COG Bonding M/C
Our company is specialized exporter, manufacturer and supplier of COG Bonding M/C in China.


           

Manufacturer/supplier's information

Company: Shenzhen Sunsom Automation Equipment Co.,LTD.
Address: 4/F, block C, Liyue industrial park, the 4th industrial zone of Fenhuang, Fuyong
Region: Shenzhen, China
Contact Person: Nancy
Telephone: +86-15989570095

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