FOG/FOB Bonding M/C

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Detailed FOG/FOB Bonding M/C Description:


Application:
The machine is used for bonding FPC, COF, TAB onto various LCD panels and PCB.

Key Feature:
■Double cylinders of SUNSOM pressure system can eliminate the self-gravity. Minimum pressure accuracy is 0.1kg.
■Multi-level pulse source design meet the pressure requirement of diversified products.
■Servo memory function and auto-location function meet the efficiency of alignment, assembly and repair work.
■Japanese precise SMC pressure components.
■Interstice vacuum suction of bond head rotary work, save one second suction time and reduce the gas wastage.

FOG/FOB Bonding M/C
Our company is specialized exporter, manufacturer and supplier of FOG/FOB Bonding M/C in China.


           

Manufacturer/supplier's information

Company: Shenzhen Sunsom Automation Equipment Co.,LTD.
Address: 4/F, block C, Liyue industrial park, the 4th industrial zone of Fenhuang, Fuyong
Region: Shenzhen, China
Contact Person: Nancy
Telephone: +86-15989570095

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