TAB/FOB Bonding M/C

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Detailed TAB/FOB Bonding M/C Description:


Application:
The machine is used for bonding FPC, COF, TAB to various LCD panels and PCB.
Key Feature:
■ Double cylinders of SUNSOM pressure system can eliminate self-grativity of bond head. Minimum pressure accuracy is 0.1 kg.
■High strength and high precision aluminium of LCD table avoid distortion, dislocation and clearance.
■Three circuit of bond head, adjustable to mass-production, manual mode and testing mode, solve the inconvenience of up-down movement.
■Stepping memory system and auto-location solve the inconvenience of table movement.
■Imported vision system, controlling system and temperature system.

Additional Options:
Machine build to customer request.

TAB/FOB Bonding M/C
Our company is specialized exporter, manufacturer and supplier of TAB/FOB Bonding M/C in China.


           

Manufacturer/supplier's information

Company: Shenzhen Sunsom Automation Equipment Co.,LTD.
Address: 4/F, block C, Liyue industrial park, the 4th industrial zone of Fenhuang, Fuyong
Region: Shenzhen, China
Contact Person: Nancy
Telephone: +86-15989570095

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