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| No. | Items | Spec |
| 1 | Layers | 1-24 layers PCB |
| 2 | Material Type | FR1-1;FR4;CEM-1;CEM-3;Rogers |
| 3 | Finish Plating | HASL,LF-HASL,ENIG,OSP,Immersion Silver,Immersion Tin,Immersion Nickel,Hard Gold |
| 4 | Material Thickness(in inches) | 0.063";0.080";0.093"0.125";0.220";0.047";0.031";0.020";0.005" |
| 5 | Copper weight | Outer:up to 7OZ;Inner:up to 4OZ |
| 6 | Max.finished board size(in inches) | 22"*28" |
| 7 | Trace/Space width | 3/3 mil |
| 8 | Smallest pad size | 12 mil |
| 9 | Smallest Hole(Finished) | 4 mil laser |
| 10 | Gold Fingers | 1 to 4 Edge(30 to 50 Micron Gold) |
| 11 | Profiling | Punching,Routing,V-CUT,Beveling |
| 12 | Special Requirements | Buried & blind vias+Controlled impedance+BGA |
| Company: | DAYEE SCI-TECH (H.K) CO LTD |
| Address: | Building 2, Tongfuyu Industrial Zone, Shatian County, Kengzi Town, Longgang District, Shenzhen City |
| Region: | Shenzhen, Guangdong, China |
| Contact Person: | Mr. steven chan |
| Telephone: | 86-755-28548369 |
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