Jambo Game Card Pcb Reverse Engineering

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Detailed Jambo Game Card Pcb Reverse Engineering Description:


JAMBO game card PCB reverse engineering
Specification: Base Material: FR-4 ; Copper Thickness: 1oz ; Board Thickness: 1.0mm ; Min. Hole Size: 0.25mm ; Min. Line Width: 0.2mm ; Min. Line Spacing: 0.2mm ; Surface Finishing: HASL ; Green: White ;
pcb reverse engineering, printed circuit fabrication pcb board assembly;circuit pcb test
Surface Mount Technology (SMT)
Through Hole Circuit Boards fabrication (PTH)
Mixed Technology PCB reverse engineering
Functional Testing
Automated Optical Inspection - Inline
Box Build; Full Assemblies
Design for Manufacturability (DFM)
Full Project Management
Engineering Design
IPC CLASS II and CLASS III certified
BGAs and CCGAs
Micro and Fine Pitch BGAs
SMT 24" x 30"for press fit Backplanes
CGA's to 1.0mm
PBGA's, uBGA's
CSP,s to 0.5mm
leaded parts to 0.3 mm
chips and discretes to 0402
chips and discretes to 0201 (pending-please inquire)
Automatic wave solder 18" max board width x __ length
Selective soldering capabilities - no board size limitation
Full autopress capability for high density press fit connectors
(VHDM R and Zpack R)

  • Model: LY85560009
  • Packing: Export Standard
  • Terms of Payment: T/T,T/C
  • Delivery Time: 30 Days
  • Products ID: 112398
  • Product Category: PCB & PCBA
  • Post date: Aug 15, 2011
Our company is specialized exporter, manufacturer and supplier of Jambo Game Card Pcb Reverse Engineering in China.


           

Manufacturer/supplier's information

Company: Shenzhen Linking-Tech Electronics Co., Ltd.
Address: 6/F,R2-B,South Section,Hi-tech Industrial Park,Shenzhen,PRC
Region: ShenZhen, Guangdong, China
Contact Person: Mr. Kareem Li
Telephone: 86-0755-26972698

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