Detailed Print Circuit Board Description:
PCB specifications: 1) The materials of copperplate: FR4 CEM-3 94V-0 GE IML. 2) Max. spelling board size: 457 x 762mm, large board size possible upon requests. 3) Layers single double 4-16 layers. 4) Board thickness: 0.2-2.5mm. 5) The smallest aperture: 0.2mm. 6) The smallest width of line: 0.10mm. 7) The smallest distance of line: 0.10mm. 8) The smallest SMT jointing plate: 0.3mm. 9) Warp permitting value of board surface: +-0.7%. 10) The smallest bridge of hinder jointing: 0.10mm. 11) Surface craft: HAL flash gold OSP cold contacts immersion gold. 12) Special craft: blue or yellow character open hole or taphole. 13) Hinder jointing: liquid sensitization glue. 14) Skewer head gilt: nickel 5um; gold 0.75um. 15) Figuration making: Numerical control mill/opened V trough/rush and cut. 16) Solder mask: PSR4000, PSR2200. 17) Profile: routing, punching, scoring. 18) Inspection: 100% E-test 100% visual inspection, AOI for inner-trace. FPC specifications: 1) Film thickness: PI 25 35 50 75 100um. 2) PET: 12.5 25 35 50 75um. 3) The thickness of copper: 18 35 50 70 100um. 4) The smallest width of line: 0.08mm. 5) The smallest distance of line: 008mm. 6) The smallest aperture: 0.25mm. 7) Max. size: 900 x 600mm. 8) Layers and structure: single double 4 layers rigid-flex mix. board. 9) Peel strength soldering: >0.7N/mm. 10) Soldering: PI 260 degree of Celsius 6s; PET 135 degree of Celsius 5s. 11) Flexural resistance: R=7, load 100g > 104. 12) Insulation resistance: >100MΩ (500V). 13) Surface craft: gold sin/lead OSP
- Products ID: 14878
- Product Category: PCB & PCBA
- Post date: Aug 6, 2008
Our company is specialized exporter, manufacturer and supplier of Print Circuit Board in china.
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