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| Sapphire Wafer 2" R-plane | |
| Property | Specification |
| Surface Orientation | R-plane(1-102) |
| Diameter | 50.8±0.1mm |
| Thickness | 0.43±0.025mm |
| Bow | ≤10um |
| TTV | ≤5um |
| Roughness(Ra) | ≤0.3um |
| Orientation Flat | 45i from C-axis Projection onto R-plane |
| Flat Length | 16.0±0.8mm |
| Front Surface Finish | Epi-ready |
| Back Surface Finish | As-lapped(SSP)or Epi-ready(DSP) |
| Company: | Shanghai Panmeng Electronic Materials Co., Ltd. |
| Address: | Room2007,Buliding 1,600# Tianshan Road |
| Region: | Changning District, Shanghai, China |
| Contact Person: | Ms. Maggie Wu |
| Telephone: | 86-21-61457121 |
Ic Grade Mono Silicon Polished Wafers